Packaging and wiring of electronic modules, manufacture of hybrid thin-film and thick-film micro-packages,
photochemical and screen printing methods of PCB production as well as a number of other technologies are performed at the
IMZ’ modern specialized shops.
Manufacture of PCB has been launched since 1970. Nowadays we have gained experience in production of single-
and double-sided boards with soldering mask for surface wiring as well as multilayer (up to 12 layers) boards.
The enterprise has twenty-year’s experience in manufacture of thick-film micro-packages. Today this
technology is applied for making micro-packages for further use in medical appliances, power electronics and specific products.
The manufacture integrates the end-to-end cycle for producing CMOS solid-state chips with an aluminium and
polysilicon gates and minimum topologic size less than 2 mcm as well as analog chips by means of bipolar process. Diameter
of boards equals to 100 mm. On order our enterprise is ready to customize small or average-size batches of specialized LSI
The IMZ includes a LSI photo-masks production area with a full technologic cycle. The enterprise also
fabricates high-quality ceramic products of a complex configuration from various ceramic materials such as ВК94-1, Vlle-3.